Microstructural, Thermal, and Mechanical Characterization of TPU Composites Using Hybrid MWCNT–Graphene Nanofiller for Thermal Management

Advanced thermal management applications, including electronics cooling, battery systems, and micro heat exchangers, are increasingly requiring thermally conductive yet flexible polymer composites. Composite films containing total nanofiller loadings of 2.5, 5, 7.5, and 10 wt.% were systematically characterized using SEM, TGA, DSC, TT, and SSTM following ASTM C177-19. SEM analysis confirmed uniform dispersion and effective network formation of MWCNTs and GNPs within the TPU matrix at higher filler loadings. Thermal stability improved significantly, with the degradation onset temperature increasing from 319.2 °C for pure TPU to 369 °C for the TPU/MWCNT/GNP (90/5/5 wt.%) composite. DSC results revealed enhanced glass transition and melting temperatures, indicating improved thermal resistance and crystallinity. Mechanical testing showed a substantial increase in Young’s modulus, reaching 72.5 MPa for the 90/5/5 wt.% composite, corresponding to a 286.66% improvement over pure TPU. Most notably, steady-state thermal conductivity increased dramatically from 0.20 W/mK for pure TPU to 1.533 W/mK for the 90/5/5 wt.% composite, representing a 666.50% enhancement. The experimental results closely aligned with percolation-based theoretical models at higher filler concentrations. Overall, the developed hybrid nanofiller TPU composites demonstrate a synergistic improvement in thermal conductivity, mechanical strength, and thermal stability, making them promising candidates for flexible thermal management components in electronics, automotive, renewable energy, and biomedical applications.