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Long-term drift of a bandgap voltage reference by molding compound oxidation during extended thermal aging | Synapse
March 3, 2026
Long-term drift of a bandgap voltage reference by molding compound oxidation during extended thermal aging
EA
Edinso Gabriel Marina Alonzo
Centre National de la Recherche Scientifique
RR
René Theodora Hubertus Rongen
NXP (Netherlands)
MS
M. van Soestbergen
NXP (Netherlands)
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Key Points
Voltage references exhibit drift over long-term thermal aging, driven significantly by molding compound oxidation.
The study found a notable voltage change of 20 mV after 1000 hours at 125°C due to oxidation effects.
Analysis of thermal aging under accelerated conditions was performed to evaluate voltage reference stability across various environments.
These findings highlight the need for enhanced material stability to improve the reliability of electronic components under thermal stress.
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Cite This Study
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Alonzo et al. (Tue,) studied this question.
synapsesocial.com/papers/69a761eac6e9836116a3000b
https://doi.org/https://doi.org/10.1016/j.microrel.2026.116043