Dual-function conductive silver paste: Application of epoxy system based on curing resistance evolution in packaging and flexible electronics

Key Points

• The aim is to explore the properties and applications of silver paste in epoxy systems for electronics.
• Developed epoxy resin-based silver paste.
• Evaluated mechanical properties and interfacial adhesion.
• Assessed curing process effectiveness.
• Silver paste showed superior mechanical properties.
• Enhanced interfacial adhesion was observed in epoxy systems.
• Curing resistance improved over specified conditions.