Background: Chitosan has been increasingly used in the management of infective wounds over the past 2 decades. However, there is still a lack of comprehensive bibliometric analysis in this area. This study seeks to assess the global research landscape of chitosan in infected wound care, aiming to identify current trends and potential research directions. Methods: Data were retrieved from the Web of Science Core Collection and analyzed using VOSviewer, CiteSpace, and ArcGIS for bibliometric visualization. This analysis encompassed annual publication trends, key journals, authors, institutions, countries, and keywords. Results: This bibliometric analysis reviewed 501 publications (January 2002–April 2025), revealing a steady increase in research output. The *International Journal of Biological Macromolecules* published the most articles, while the *Chemical Engineering Journal* had the highest citation impact per article. China led in publication volume, followed by India and Iran. Institutional analysis identified the top 5 research centers, primarily based in China and Iran, with Qingdao University at the forefront. Among authors, Jayakumar Rangasamy was the most prolific, while Guo Baolin received the highest citations per article. Keyword analysis identified 2 main research areas: functional chitosan-based hydrogels and chitosan-based delivery systems for treating infective wounds, a globally significant healthcare challenge. Conclusions: Chitosan-based nursing in infected wound care is an increasingly important and clinically relevant option. Bibliometric analysis identified China, India, and Iran as the leading contributors to this field. Emerging research focuses on chitosan delivery system and chitosan mixed metal oxide nanoparticle antimicrobial agents in infected wound healing. The development of new chitosan-based technologies to combat wound infections and maintain efficacy against potential future drug-resistant bacteria will be essential for future advancements in wound care.
Zhang et al. (Fri,) studied this question.