To address the challenge of removing copper from copper–ammonia complex wastewater in the printed circuit board (PCB) industry, this study employed natural chitosan (CTS) as the base material. Dithiocarbamate (DTC) groups were grafted onto CTS, followed by further carboxylation (-COOH) to produce two novel adsorbents: DTC-CTS and DTC-CTS-COOH. The materials were characterized using Fourier transform infrared spectroscopy (FTIR), X-ray photoelectron spectroscopy (XPS), SEM, and related techniques. The effects of solution pH, adsorption isotherms, kinetics, and regeneration performance were systematically investigated. Characterization results confirmed the successful introduction of DTC and carboxyl (-COOH) groups. Adsorption experiments demonstrated that DTC-CTS-COOH exhibited superior Cu2+ adsorption performance across pH 5–8, achieving a removal efficiency of (97.67 ± 1.3)% at pH 7. Its adsorption behavior followed the Langmuir model, with a maximum adsorption capacity (Qm) of 234.8 mg·g−1 at 318.15 K, significantly higher than that of DTC-CTS (183.6 mg·g−1). Adsorption kinetics conformed to a pseudo-second-order model, indicating rapid adsorption rates. After five adsorption-desorption cycles, DTC-CTS-COOH maintained a Cu2+ removal rate above 68.41%. The synergistic interaction between -COOH and DTC functional groups enhanced the adsorbent’s capacity, rate, and pH adaptability, demonstrating that DTC-CTS-COOH holds strong potential for application in the treatment of complex copper–ammonia wastewater.
He et al. (Fri,) studied this question.