Adhesion Enhancement between Colorless Biphenyl Polyimide Copolymerized Film and magnetron sputtering Cu for FPC circuit board

Key Points

• This research aims to improve the adhesion between colorless polyimide films and copper deposits used in electronic circuit boards.
• Evaluated the adhesion strength of the colorless polyimide film with magnetron sputtered copper
• Conducted surface treatments on the polyimide film
• Used various testing methods to assess adhesion quality.
• Significant improvement in adhesion strength observed after surface treatments
• Results support enhanced reliability of circuit boards in electronic applications.