A Modular Ring-Oscillator Array Chip for Accurate Stress Testing of CMOS Aging Mechanisms

Key Points

• The research aims to develop a chip that can effectively test the aging mechanisms in CMOS technology using modular ring-oscillator arrays.
• Design and fabrication of a modular ring-oscillator array chip
• Implementation of stress testing protocols for CMOS components
• Evaluation of aging mechanisms through real-time measurements
• The modular design allows for precise control and accurate measurements of aging effects
• Findings suggest improved understanding of stress impact on the longevity of CMOS devices
• Demonstrated capability to identify specific aging mechanisms effectively