The study presents a novel process to design lightweight, high-performance cooling manifolds for power electronics using generative design. The process begins with a baseline design that defines the constraints of the manifold with regard to the target cooling geometry and flow path. A flow optimization is then performed to optimize flow distribution and maximize convective efficiency. Once a final fluid volume is obtained, a structural optimization is conducted to minimize weight and material usage. The simulation results for the final design demonstrated a 40.1% increase in the average heat transfer coefficient, a 7.5% decrease in average chip temperature, a 76.6% improvement in temperature uniformity, and a 63.3% reduction in weight at the expense of a minimal 5.1% increase in pressure drop compared to the baseline design.
Arriola et al. (Wed,) studied this question.