The dynamic development of electronic devices, telecommunications systems, and high-frequency technologies is leading to growing problems related to electromagnetic interference (EMI) emissions and susceptibility. Classic shielding materials, such as solid metals, despite their high effectiveness, are characterised by high weight, limited formability, and poor compatibility with modern processing technologies. Therefore, there is growing interest in lightweight polymer composites with adjustable electrical and electromagnetic properties.This paper presents a comparative analysis of the electromagnetic shielding (SE) effectiveness of ABS-based composites modified with carbon (CB, GNP) and metallic (Cu(F), Sn) fillers, with particular emphasis on the hybrid ABS + Cu(F) + Sn system. The simultaneous use of copper fibres and tin powder in polymer composites is rarely described in the literature, which gives the presented research a clearly innovative character.The composites were produced by hot pressing at a filling degree of 10–30% by volume and were tested for resistivity, conductivity, electrical permeability, and shielding effectiveness in the 0.3–6 GHz band. The analyses were supplemented with microstructural studies (SEM) and an assessment of filler dispersion, including the use of selective laser ablation. The results clearly showed that composites with metallic fillers exhibited higher shielding effectiveness compared to those with carbon additives. ABS-Sn composites achieved SE values above 60 dB at 30% vol. filling, while the hybrid ABS-Cu(F)-Sn system was characterised by the highest effectiveness, reaching 65 dB, with an absorption-reflection mechanism. The synergistic interaction of copper fibres and tin particles led to the formation of a continuous, spatial conductive network of inter-linked connectors , significantly affecting wave impedance and EM wave attenuation mechanisms.The results confirm that ABS hybrid composites with metallic fillers are a promising alternative to classic metal screens in civil, industrial, and military applications.
Augustyn et al. (Sat,) studied this question.