This study conducts a quantitative analysis of the thermal bridge effect caused by the joints during the construction of vacuum insulation panels, revealing a significant positive correlation between the width of the joints and the increase in the heat transfer coefficient of the wall. Calculations show that when the width of the board joint increases to the upper limit of 20 mm, the deterioration rate of the heat transfer coefficient of the wall can reach 40% (i.e., the insulation performance will decline by approximately 33%). Based on this, a dynamic correction model for thermal conductivity is proposed. This model achieves the engineering quantitative correction of the thermal bridge effect by introducing the panel gap attenuation factor, providing a key parameter basis for the thermal design of the insulation system. At the same time, energy consumption calculations are conducted for passive buildings using composite insulation boards. The impact of vacuum insulation board failure on building energy consumption before and after is analyzed, as well as the methods for ensuring the operation of the building in the later stage, providing a reference for the subsequent engineering design of the built-in insulation system using composite insulation boards.
Zhang et al. (Sun,) studied this question.