Numerical analysis of enhanced heat transfer and entropy generation in microchannel heat sink equipped with lancet pin fin and protrusion structure for advanced electronic cooling applications

Key Points

• Enhanced heat transfer occurs in microchannel heat sinks with pin fin designs, improving thermal management significantly.
• Results indicate a 30% increase in heat transfer efficiency compared to standard configurations, underlining its potential.
• Numerical analysis simulates heat transfer performance across various designs, focusing on entropy generation factors.
• These findings highlight the need for innovative cooling solutions in electronics, which can reduce overheating and improve reliability.