Reliability design of power modules: multi time sequence simulation of soldering warpage deformation and fatigue life prediction of solder layers | Synapse
March 3, 2026
Reliability design of power modules: multi time sequence simulation of soldering warpage deformation and fatigue life prediction of solder layers
Key Points
Fatigue life prediction indicates potential issues with solder layers, affecting module reliability.
Key findings suggest high levels of warpage, threatening the performance of power modules during operation.
Simulations assess soldering warpage deformation over time, capturing dynamic mechanical behavior and stress.
Highlights the need for optimization in design processes to improve the durability of electronic components.