A comparative analysis of the dielectric, thermal and mechanical characteristics of butyl rubber composites with low dielectric fillers for flexible microwave substrate applications | Synapse
March 3, 2026
A comparative analysis of the dielectric, thermal and mechanical characteristics of butyl rubber composites with low dielectric fillers for flexible microwave substrate applications
Key Points
Dielectric characteristics improve with low dielectric fillers, enhancing performance in microwave applications.
The thermal characteristics of the composites showed marked improvement, with some fillers yielding significant benefits.
Observational analysis of various fillers demonstrates their influence on mechanical characteristics and suitability for applications.
Findings highlight the promise of butyl rubber composites, indicating their effective use in flexible microwave substrate technologies.