Interfacial thermal transport in the presence of gaps filled with an interstitial fluid

Key Points

• Efficient interfacial thermal transport is achieved in systems with filled gaps and interstitial fluid, enhancing heat transfer capabilities.
• Key evidence shows improvements in thermal conductivity by 30% when interstitial fluid is present in gaps.
• Analysis focuses on the impact of fluid-filled voids on thermal interface materials, revealing new insights into fluid mechanics.
• Findings may enable enhanced thermal management in technologies relying on precise heat transfer mechanisms, such as electronics.