Phase change material based hybrid heat sink for thermal management of electronic devices under intermittent heat flux boundary conditions

Key Points

• Improved thermal management leads to better cooling in electronic devices under varying heat levels.
• Thermal conductivity of the phase change material directly influences the performance of the heat sink.
• Assessment using hybrid heat sink demonstrates effectiveness in managing intermittent heat flux conditions.
• Highlights the need for advanced cooling solutions in high-performance electronics to prevent overheating.