Polyimide composites with optimized low dielectric constant and high thermal conductivity for electronic packaging

Key Points

• Composites exhibit a significantly low dielectric constant of 2.5 and high thermal conductivity of 1.2 W/mK, enhancing electronic packaging performance.
• The study demonstrates a focused optimization process for polyimide composites to achieve ideal properties for electronics.
• Analysis using various material characterization techniques confirms the effective combination of low dielectric and high thermal conductivity in polyimide composites.
• These optimized properties highlight the potential for better electronic device performance and reliability, paving the way for advancements in packaging solutions.