Dual-pathway mechanism of Fe-doped CeO2 abrasives in photo-Fenton-assisted CMP of SiC

Key Points

• Improved chemical mechanical polishing efficacy is noted with Fe-doped cerium dioxide abrasives, achieving superior results.
• The introduction of iron enhances the photo-Fenton process, evidenced by increases in abrasion rates and surface quality.
• Observational analysis utilizing chemical mechanical polishing demonstrated significant advancements using novel iron-doped abrasives.
• These findings highlight the potential for more efficient abrasive materials, emphasizing the application in semiconductor processing.