The fatigue life of solder balls in Ball Grid Array (BGA) packages of a Printed Circuit Board (PCB) assembly is a key factor that influences the reliability of electronic devices. This study explores three novel methods to enhance the fatigue life of the PCB assembly with BGA packages, focusing on stress reduction techniques in solder balls under random vibration. The numerical analysis of the PCB assembly examined stress distributions and identified optimal design strategies to improve resistance to fatigue under random vibration. The findings demonstrate that strategic positioning of BGA packages, the use of additional supports, and modifications to PCB assembly can significantly reduce stress on solder balls, thus extending their fatigue life 8 to 10 times that of the existing design.
Nehruji et al. (Fri,) studied this question.