Tungsten-copper laminated composites are promising materials for high heat-flux applications, but their performance is often limited by interfacial instability caused by the thermal-mechanical mismatch between tungsten and copper. In this study, W/W-30Cu/CuCrZr three-layer composites are fabricated by high-pressure torsion (HPT) processing. Experimental characterization and molecular dynamics (MD) simulations are used to systematically investigate the influence of HPT process parameters and intermediate-layer composition on the evolution of microstructure and mechanical properties. HPT processing significantly refines the grains of the W-xCu composites and enhances their homogeneity. After applying 15 revolutions of HPT on W-30Cu composites, the crystallite size decreases by about 45.3%. The dislocation density increases to 5.95 × 1014 m−2. The interfacial transition zone of tungsten-copper three-layer composites is continuous and stable after HPT processing, and the microhardness is gradient increasing along the radial direction, showing good stress coordination ability and interfacial bonding characteristics. With the increase of W content, the yield strength of W-xCu alloy increases significantly, but the ductility decreases. The W-30Cu system achieves the optimal balance between strength and ductility. At the same time, in the W/W-Cu/Cu model, as the number of dislocations increases, the yield stress and elastic modulus increase by about 15% and 22%, respectively, indicating that the high-density defects introduced by HPT have a significant strengthening effect on the composite system. This study provides an important theoretical basis and experimental support for the microstructure control and performance optimization of tungsten-copper laminated composite material.
Wang et al. (Thu,) studied this question.