The growing market of high‐performance electronic devices and integrated circuits has increased the demand for efficient thermal management solutions, especially in open and moisture‐prone environments. In this study, we report a facile and scalable method for the fabrication of flexible reduced large‐sized graphene oxide (rLGO) thin films using conventional graphene oxide (GO) and LGO samples v ia the doctor blade casting method with controlled evaporation, followed by low‐temperature chemical reduction. The rLGO film exhibited a high Young's modulus of 2.09 GPa and tensile strength of 94.3 MPa, than a small area conventional reduced GO (rGO) thin film (Young's modulus of 0.86 GPa and tensile strength of 56.7 MPa). Further, the rLGO thin film revealed a higher water contact angle and lower surface energy than the rGO film. The thermal conductivity of rLGO film is much superior to that of conventional rGO film. This facile and scalable fabrication of graphene thin film with improved heat‐spreading performance would be an effective solution as thermal interface materials in next‐generation electronic devices.
Rajput et al. (Sat,) studied this question.
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