A multiscale constitutive model is developed to investigate the thermomechanical behavior of diamond/Cu composite for high-reliability military electronics. The critical thermomechanical response, such as multiscale elastic response, average thermal expansion, and theoretical heat transport of diamond/Cu composite, are further simulated to predict the thermomechanical properties of composite in this study. The results indicated that the enhanced both mechanical load transfer efficiency and thermal transport characteristics of composite, arose from the synergistic effect of the intrinsic properties of the constituents. Systematic parametric studies revealed the decisive dependencies on constituent design and interfacial optimization. The proposed modeling framework provides a robust foundation for designing next-generation thermal management composite with tailored thermomechanical properties under extreme operating conditions.
Chen et al. (Sun,) studied this question.