Aging semiconductor manufacturing equipment lacks safety measures compared to the latest equipment, and risk reduction activities by equipment users are required. In this paper, we used the work of a lapping machine in the silicon wafer manufacturing process as a model to create a risk assessment sheet that conforms to the "hybrid matrix (HM) method," which was developed to solve the problems with the current risk assessment method for users, and examined its effectiveness. In the risk assessment of the HM method, the effect of risk point reduction after the implementation of risk reduction measures is clearly shown with numerical values. Then it's possible to compare in advance the types of risk reduction measures for aged semiconductor manufacturing equipment and to study the optimal safety measures. Additionally, a risk assessment sheet specific to semiconductor manufacturing equipment was designed in accordance with the HM method, helping the risk assessment team to proceed without delay. As a result, it can be said that the HM method of risk assessment using a specialized risk assessment sheet is effective in reducing the risk of aged semiconductor manufacturing equipment.
AMANO et al. (Wed,) studied this question.