Improving Flame Retardancy and Heat Resistance of Printed Circuit Board Materials via Poly(2,6-dimethyl-1,4-phenylene sulfide) Blending

Key Points

• The research aims to improve the heat resistance and reduce transmission loss of printed circuit board materials using PMPS-V.
• Developed printed circuit boards using poly(2,6-dimethyl-1,4-phenylene sulfide) resin (PMPS-V) instead of traditional materials.
• Evaluated the dielectric properties and flame retardancy of PMPS-V blended boards.
• Conducted heat resistance tests at 150°C and measured signal propagation characteristics up to 60 GHz.
• Achieved a low dielectric constant of 0.0017 for PMPS-V boards.
• Attained UL94 V-0 flame retardancy with one third of the typical flame retardant additives.
• Demonstrated reduced transmission loss and improved eye diagram performance during signal testing.