MEMS XY stages used in optical image stabilization (OIS) systems require large planar displacement while maintaining sufficient structural stiffness to support optical elements and adequate dynamic bandwidth for stabilization performance. This work presents an electrostatic comb-drive MEMS XY stage designed as a planar platform for integration with out-of-plane microlens actuators. The stage features a 6 × 6 mm² central platform and a symmetric suspension architecture combining dual-length folded-beam flexures and tethering, enabling a high bearing-to-stroke stiffness ratio and high vertical stiffness. Fabrication on a 100 µm-thick silicon-on-insulator (SOI) device layer further improves mechanical stiffness and load-support capability. An analytical stiffness and stability model, supported by finite-element modeling (FEM), predicts linear force–displacement behavior and the maximum stable travel range. The fabricated device is experimentally characterized under static and dynamic actuation, showing good agreement with analytical and numerical predictions. Measurements demonstrate a pull-in-free, repeatable in-plane displacement of ±50 µm at 60 V in both X and Y axes with negligible cross-axis coupling. The first measured resonance corresponds to the fundamental in-plane mode at 520 Hz, which is predicted through FEM to decrease to approximately 104 Hz under a 60 mg applied load, while remaining well above dominant hand-tremor frequencies. A geometric displacement-to-angle analysis indicates an estimated optical correction capability of approximately ±0.5° to ±3° depending on focal length. These results indicate that the proposed stage provides large stroke planar motion at low voltage while supporting actuator-level optical assemblies and maintaining dynamic characteristics compatible with OIS-oriented microlens positioning. • A comb-drive XY micro-stage designed for microlens positioning in optical image stabilization systems, • Dual-length folded-beam suspensions provide high out-of-plane stiffness and a large bearing-to-stroke stiffness ratio, • A 100 µm-thick SOI device layer and large central platform enable support of actuator-level optical loads, • Decoupled ±50 µm motion in X and Y is measured at ~60 V, predicting ±0.5°–±3° optical correction depending on focal length, • An in-plane resonance of ~104 Hz under a 60 mg load is predicted, remaining well above dominant hand-tremor frequencies.
Jafarsadeghipournaki et al. (Sun,) studied this question.