The accurate estimation of thermal contact conductance (TCC) is a fundamental need towards the optimal design of a cryogenic cooling system for the new flagship beamline CSXID at Diamond Light Source, which utilizes mechanically pressed copper components to form the heat conduction path. To aid development, a study of thermally conducting joints at cryogenic temperatures has been performed combining Simulink and ANSYS Mechanical. To verify and validate the simulation results, an experimental setup will be made to carry out experiments to determine performance of the system, taking into consideration parameters including surface roughness, surface finish, temperature, & clamping force, which all greatly influence TCC.
Tillin et al. (Thu,) studied this question.