Purpose The purpose of this paper is to provide a systematic review of technical findings and discuss the technical challenges of Silicon photonic packaging deployment for future artificial intelligence (AI) datacenter applications. Also, with the aim of studying and comparing the hard requirements, reliability mitigation and future directions with respect to other silicon packaging options. This paper discusses the holistic overview of silicon photonics packaging reliability, technical barriers and future directions. Design/methodology/approach Literature reviews are conducted based on a list of silicon photonics packaging solutions and possible technical solutions. Detailed AI–datacenter technical challenges, findings and selection of electronic packaging materials with optical interconnect technical requirements and hardware reliability considerations are presented in this review paper. The future and status of photonic interconnects are also discussed in this review paper. Findings This paper briefly reviews key aspects of material selection, thermal management and alternative bonding options, focusing on reliability performance and discusses how to meet end hardware reliability requirements of Silicon photonic packaging for future AI datacenter applications. Research limitations/implications In-depth technical review encompasses the holistic overview of silicon photonic packaging and deployment in future AI datacenters. Practical implications The paper reveals the technical considerations when choosing the silicon photonics packaging options from components to system-level technical requirements. Originality/value An in-depth technical review of material selection, thermal management and hardware reliability requirements in microelectronics packaging, based on prior literature.
Gan et al. (Mon,) studied this question.