Electrospun nanomesh sheets are promising for skin electronics because of their flexibility and breathability. However, device integration technologies must be established to enable their practical application. This study investigated a new method for room-temperature direct bonding of Au-coated nanomeshes for the development of integrated, flexible, and breathable electronics. Conventional cold welding of Au typically requires high pressures (>100 MPa) or surface activation. In contrast, this technique achieved robust Au-Au bonding at an external pressure of approximately 1 MPa. The bond was formed within 3 s and maintained high electrical reliability, with resistance changes remaining within 5% over 8000 bending cycles at a radius of 1 mm. Critically, the process preserved the breathability of the substrate, exhibiting a water vapor transmission rate comparable to that under open-air conditions. This method provides a reliable integration strategy for next-generation on-skin devices.
Ebihara et al. (Wed,) studied this question.