Using radio-frequency impedance spectroscopy in the 0.001–10 MHz range, the insulating properties of silicon-on-insulator (SOI) structures with nanometer-thick buried oxide (BOX) layers of SiO2 or HfO2 : Al2O3 (15 : 1) on low-resistance Si substrates with TR-HR layers with traps (TR) and high resistance (HR) up to 2 μm thick were studied for their application in microwave and radio-photonic integrated circuits. These layers were formed by the implantation of CO+ ions into Si substrates and rapid thermal annealing.
Popov et al. (Wed,) studied this question.
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