As the power density of office computing clusters rises to 200–250 W per chip, the substantial heat generated during operation not only impairs chip performance and shortens lifespan but also compels heating, ventilation, and air conditioning (HVAC) systems to operate at high loads. This increases energy consumption by 30–40% and causes indoor temperature fluctuations that reduce office workers’ comfort. Targeting centralized thermal management for such clusters, this study proposes a hybrid cooling strategy integrating outdoor natural cold air (as a continuous heat sink) with phase change materials (PCMs, for transient heat peak absorption). Six adjustable heating plates (power range: 50–250 W per unit, simulating 7 nm office chips) mimicked heat dissipation in a six-chip cluster. Latent heat storage (LHS) units served as passive cooling, with fan coils as auxiliary for natural/forced convection. By using PCMs (melting point: 48 °C) to absorb transient peaks and coils to utilize outdoor cold air, the system maintained circulating water at approximately 60 °C (steady-state equilibrium temperature under full-load conditions) and kept chip temperatures below 80 °C (industrial safety threshold). The hybrid system reduced combined pump and fan power to 125 W, achieving 75% energy savings compared to the HVAC system (500 W) and 40% savings compared to using only natural cold air (210 W pump and fan power). Positive pressure in the outdoor unit (increasing coil air velocity by 1.2 m/s relative to natural convection) further improved heat dissipation efficiency by 15%. Finally, this study quantifies the influence of PCM thermal conductivity and filling mass on the system’s temperature control performance through numerical simulations, providing direct evidence for parameter design of LHS units.
Ren et al. (Sat,) studied this question.
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