Preparation and Plugging Performance Evaluation of Epoxy Resin Particles via an Optimized Synthesis Method

To overcome polymer-based plugging materials’ disadvantage of being prone to degradation and failure under hydrothermal conditions, an epoxy resin plugging particle with a high-pressure-bearing capacity under high temperatures was prepared by optimizing the curing process. Bisphenol A Epoxy Resin E51 and Diethyltoluenediamine (DETDA) were selected as raw materials for sample preparation. Due to the high viscosity of the system, 1,2-cyclohexanediol diglycidyl ether was introduced as a diluent, and an optimal concentration of 20% was determined through experimental optimization. Non-isothermal differential scanning calorimetry, bottle testing, and infrared spectroscopy were employed to investigate the variation laws of curing temperature, curing time and curing degree during the epoxy resin curing process via one-step and multi-step methods. The compressive strength of the epoxy resin prepared using the two processes was evaluated. After comprehensively comparing the preparation time, process complexity, and compressive strength of the final samples of the one-step and two-step curing methods, the one-step process (90 °C/5 h) was determined to be superior. In addition, the results of the fracture plugging experiment showed that after the bulk epoxy resin prepared using the optimized process was made into particles through a mechanical method and treated under hydrothermal conditions at 120 °C, the maximum breakthrough pressure reached 4.2 MPa, which was 950% and 135.96% higher than that of Particle 1 (Poly(2-acrylamido-2-methylpropanesulfonic acid)/acrylamide (PAMPS/AM) gel) and Particle 2 (PAMPS/AM gel treated with Polyethylene glycol (PEG)), respectively, which were used as control groups. This result indicates that epoxy resin can be used as a high-temperature-resistant plugging material and should be further researched.