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September 10, 2025Electronics13 citationsOpen Access

Recent Developments in Image-Based 3D Reconstruction Using Deep Learning: Methodologies and Applications

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DRDiana-Carmen Rodríguez-LiraDCDiana‐Margarita Córdova‐EsparzaJTJuan Terven

Key Points

  • Hybrid architectures, integrating classical and deep learning techniques, improve performance in complex scenarios.
  • Critical challenges include occlusions, low-texture areas, and varying lighting conditions: a major concern.
  • The study identifies multi-view stereo and monocular depth estimation as leading methods for 3D reconstruction.
  • Adapting computationally efficient solutions is essential for real-world applications requiring generalizability.

Abstract

Three-dimensional (3D) reconstruction from images has significantly advanced due to recent developments in deep learning, yet methodological variations and diverse application contexts pose ongoing challenges. This systematic review examines the state-of-the-art deep learning techniques employed for image-based 3D reconstruction from 2019 to 2025. Through an extensive analysis of peer-reviewed studies, predominant methodologies, performance metrics, sensor types, and application domains are identified and assessed. Results indicate multi-view stereo and monocular depth estimation as prevailing methods, while hybrid architectures integrating classical and deep learning techniques demonstrate enhanced performance, especially in complex scenarios. Critical challenges remain, particularly in handling occlusions, low-texture areas, and varying lighting conditions, highlighting the importance of developing robust, adaptable models. Principal conclusions highlight the efficacy of integrated quantitative and qualitative evaluations, the advantages of hybrid methods, and the pressing need for computationally efficient and generalizable solutions suitable for real-world applications.

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Cite This Study

Rodríguez-Lira et al. (2025) studied this question.

synapsesocial.com/papers/68c1a11f54b1d3bfb60dbd46https://doi.org/10.3390/electronics14153032
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