Electronic cooling is a critical challenge in modern technology, driven by the miniaturization and increased power density of electronic components. This paper introduces Simdroid-EC, a specialized electronic cooling simulation software developed by Beijing Internet Based Engineering Co., Ltd. Based on computational fluid dynamics (CFD), Simdroid-EC integrates multiscale, multiphysics, and cross-domain capabilities to address complex thermal management problems in electronics. The software features a library of over 40 electronic component models, enabling rapid "building-block" modeling and high-quality hexahedral mesh generation (supporting up to billions of grid elements). Algorithmically, it employs unstructured Cartesian grids, finite volume discretization, and SIMPLE-like pressure-velocity coupling methods, combined with matrix-level conjugate heat transfer (CHT) equations for enhanced convergence efficiency and accuracy. Innovations include GPU parallel computing (H20 GPU acceleration up to 20 times) and AI-based reduced-order models (ROMs) for a 1,000 times speedup while maintaining precision. The software’s visualization tools, such as contour plots, vector fields, and streamline analysis, facilitate optimized thermal design. Applications in semiconductor chips, telecommunications, and new energy systems demonstrate its effectiveness in reducing R&D cycles and costs. This work highlights Simdroid-EC as a transformative tool for high-precision, high-efficiency electronic cooling solutions.
DUAN et al. (2025) studied this question.