Time-Dependent Microstructural Transformation and Interfacial Phase Evolution in TLP Bonding of CM247LC Superalloy

The bonding behavior of the Ni-based superalloy CM247LC during transient liquid phase (TLP) bonding is strongly governed by filler metal chemistry, particularly boron activity. In this study, the time-dependent bonding mechanisms of CM247LC joints fabricated using a high-boron MBF-80 filler and a low-boron MBF-20 filler are systematically compared to clarifying the transition between reaction-dominated brazing and diffusion-assisted TLP bonding. Microstructural analyses reveal that MBF-80 promotes the formation of a persistent, reaction-stabilized interlayer characterized by strong boron localization and the development of boron-rich intermetallic reaction products. These features kinetically suppress diffusion-assisted homogenization and prevent isothermal solidification, resulting in pronounced chemical and mechanical discontinuities across the joint. In contrast, MBF-20 enables progressive boron depletion, suppression of stable intermetallic accumulation, and interfacial smoothing, leading to diffusion-assisted chemical redistribution and partial isothermal solidification. This evolution is accompanied by gradual convergence of hardness profiles toward that of the CM247LC base metal, indicating improved mechanical continuity. These results demonstrate that joint hardness alone is insufficient for evaluating bonding quality in CM247LC. Instead, controlled microstructural evolution governed by low-boron filler chemistry is essential for achieving chemically and mechanically compatible joints. The present work establishes a clear mechanistic link between filler metal composition and bonding behavior, providing guidance for the design of reliable TLP bonding strategies in Ni-based superalloys.