Temperature Distribution and Heat Dissipation Optimization of High-Power Thick-Film-Substrate LED Modules

With the widespread application of high-power thick-film-substrate light-emitting diode (LED) packages, the performance of high-power LED modules has been continuously improved, making thermal management an increasingly critical issue. To enhance the heat dissipation performance of LED modules, this study investigates the effects of different heat dissipation structures on the temperature field using a finite element-based thermal simulation method, based on the thermal management enhancement characteristics of the LED. A thermal simulation model of the LED was established, and the thermal characteristics and temperature field characterization of its components were analyzed. Our results revealed significant temperature differences at various positions of the LED, particularly near the bottom surface of the heat sink and the contact surface with the LED chips, where the heat flux density exhibited notable variations. Properly adjusting the spacing between LEDs effectively reduced the maximum temperature of the module, with the optimal spacing determined to be approximately 19 mm. To further improve heat dissipation, pin-fin arrays were added to the heat sink, leading to a reduction of 8.79 K in the maximum temperature and 9.67 K in the minimum temperature of the LED module, which significantly enhanced the heat dissipation performance. The optimization measures effectively improved the temperature field characterization of the LED, contributing to enhanced performance and an extended lifespan of the LED module.