Shape memory polymer (SMP) has broad applications in various industries, including automotive, aerospace, and medical, as it can maintain a given shape and return to its original form upon exposure to external stimuli such as heat, magnetic fields, or light. However, the intrinsic limitation of epoxy results in the low thermal conductivity of SMP, which reduces the difference in temperature (ΔT) between the glass transition temperature (Tg) and the actuation temperature, thereby negatively affecting the performance of shape recovery. In this study, the thermal stability and curing characteristics of SMP fabricated by blending Bisphenol-A epoxy with two types of amine curing agents were analyzed by thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC) to establish optimal fabrication conditions. Subsequently, carbon-based fillers, graphite and 60 μm long carbon fibers, were added to fabricate shape memory polymer composites (SMPCs). The curing and mechanical properties of the SMPCs were subsequently evaluated, and the shape recovery characteristics were found to be optimal at a filler content of 3 wt%. The recovery time for the SMPC with graphite was 25 s, representing a 68.75% improvement in shape recovery time from the SMP. Furthermore, the addition of carbon fibers, with improved dispersion, led to the highest increases in tensile strength and impact strength of 24.71% and 59.36%, respectively.
Do et al. (2026) studied this question.