Magnetron sputtering serves as a key method for fabricating functional thin films used in transparent film heaters. However, as heater designs become more intricate, achieving uniform film deposition on nonrectangular areas induces localized overheating owing to current density crowding, compromising long-term reliability of the device. To address this limitation, a simulation-assisted design and fabrication strategy is presented to realize a uniform temperature profile through the precise regulation of the sheet resistance distribution of the film. Initially, an electrothermal-coupled finite element model was established using COMSOL Multiphysics to inversely determine the spatial gradient of sheet resistance required for achieving a uniform thermal distribution. Subsequently, a custom-designed mesh shadow mask was used to locally adjust the flux of indium tin oxide (ITO) sputtered particles, enabling the establishment of a relationship between the mask’s aperture geometry and the resulting particle deposition profile. The magnetic field and plasma simulations were integrated to model particle transport and design a specialized gradient aperture-based shadow mask, enabling the deposition of an ITO film with a controlled sheet resistance gradient in a single magnetron sputtering step. Experimental results demonstrated that the proposed method decreased the maximum temperature variation by 8.25 °C and reduced the standard deviation of the surface temperature by 82.1% at an average temperature of 45 °C within a defined nonrectangular heating region, demonstrating a substantial improvement in temperature uniformity relative to conventional uniform coating processes.
Shi et al. (Wed,) studied this question.
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