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February 22, 2026Thermal Science0 citationsOpen Access

Design of a biomimetic thermal interface material based on soybean lecithin and its transient high heat flux heat dissipation

MLMin LiXQXiaocui QiRLRongyao Li

Key Points

  • To create a highly efficient electronic heat dissipation material using soybean lecithin and nanoalumina.
  • Produced a porous composite material using vacuum drying and biomimetic template casting.
  • Established an experimental system for measuring heat and temperature.
  • Developed a 3-D simulation model with ANSYS FLUENT to analyze thermal performance.
  • Achieved thermal conductivity of 1.92 W/mK, significantly higher than pure soybean lecithin.
  • Reduced thermal response time to 0.11 seconds at 500 W/cm2 heat flux.
  • Confirmed model reliability with a maximum error of 3.8% in temperature-time curves.

Abstract

To prepare a highly efficient electronic heat dissipation material, a porous composite material was prepared using soybean lecithin as a matrix and nanoalumina as a modifier via vacuum drying and biomimetic template casting. Simultaneously, an experimental system was constructed, including a heat source, temperature measurement, heat flux measurement, and environmental control modules (heat flux density 100-1000 W/cm2, sampling interval 0.001 second). A 3-D simulation model was established using ANSYS FLUENT (grid size 650000-780000, time step 1?10-4 second). Results show that the optimal parameters were a soybean lecithin-alumina ratio of 8:2 and a biomimetic pore size of 20 ?m. The material achieved a thermal conductivity of 1.92 W/mK (8.7 times higher than that of pure soybean lecithin), which has a thermal conductivity of 0.22 W/m?K. The thermal response time was 0.11 seconds at a heat flux of 500 W/cm2 (a 42% reduction), and the steady-state thermal resistance was 0.18 Kcm2/W (meeting the requirements of electronic equipment). The simulated and experimental temperature-time curves were in good agreement, with a maximum error of 3.8% (?5% tolerance). The relative error in the internal thermal resistance between 300 W/cm2 and 800 W/cm2 was ?4.2%, validating the reliability of the model.

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Cite This Study

Li et al. (2026) studied this question.

synapsesocial.com/papers/699a9e0e482488d673cd4686https://doi.org/10.2298/tsci2601165l
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