Ni thick films have a wide range of applications in mechanical areas for anti-corrosion, anti-friction and protection purposes, and are also extensively employed in the chip packaging field. Yet, the deposition of Ni thick films is still faced with many problems in deposition efficiency, dense structure and adhesion to the substrate. RF magnetron sputtering was employed to deposit on polished Ti substrate up to 10.8 µm thick Ni films at a high deposition rate (45 nm/min) in Ar atmosphere plus a small amount of H2. Vacuum annealing was performed at 400 °C for 5 h. To characterize the adhesion via friction and scratch test, different loads were applied on both surfaces of as-sputtered and post-annealed Ni thick films, and results were comparatively analyzed. The films have high purity, compact structure, smooth surface and strong adhesion strength. Post-annealed samples showed better and stable adhesion of Ni thick films to the substrate surface.
Bilal et al. (Thu,) studied this question.