Fluxless Reflow with “EA” Technology

A novel hydrogen activation technology based on activated hydrogen or electron attachment (EA) has been developed for fluxless soldering at ambient pressure and normal soldering temperature. The technology has the potential to be used for several applications in the electronics packaging industry. Recent work from a joint effort between Air Products and Sikama International on beta trials and in-fab trials of a production-scale furnace for flux-free wafer bump reflow based on Electron Attachment (EA) is also discussed, along with current development work in the area of solder ball drop assembly and flip chip reflow using the EA technology.