Electrodeposited HEDP-based ultrafine-grained Cu Ag alloy foils with ultra-high strength and high conductivity

Key Points

• Ultrafine-grained Cu Ag alloy foils exhibit ultra-high strength and conductivity.
• The observed strength is measured at 300 MPa, indicating exceptional durability.
• Observational analysis of electrodeposited materials demonstrates effective performance under high stress.
• These findings highlight the potential for enhanced applications in electronics and structural materials.