Submicron alignment accuracy of frontside to backside lithography for MEMS applications

Key Points

• Alignment accuracy achieved was measured at submicron levels, which is critical for MEMS applications.
• This investigation focused on the precise registration of frontside to backside lithography techniques.
• Submicron alignment methods were tested under various conditions to evaluate their effectiveness in device manufacturing.
• Results may enable improvements in the production quality of MEMS devices, requiring further investigation for practical applications.

Abstract