Hermetic packaging for photonic integrated circuits on glass interposers

Key Points

• Enhanced hermetic packaging can significantly improve the performance of photonic integrated circuits on glass interposers.
• Results suggest that using robust materials enhances optical connectivity, with improved durability observed during testing.
• Assessment of material properties shows favorable outcomes for integration and longevity of photonic integrated circuitry.
• Further development is warranted to explore broader applications and validate materials for commercial use, highlighting potential scalability.

Abstract