Passive two-phase immersion cooling achieving over 1000 W per chip via porous coated flat plate heat pipes

Key Points

• Over 1000 W per chip was achieved with passive two-phase immersion cooling and flat plate heat pipes.
• The thermal management performance highlights significant advancements in cooling technology for electronic components.
• Analysis of the cooling system utilized porous coated heat pipes for optimal heat transfer efficiency.
• These findings suggest potential for enhanced heat dissipation in high-performance computing applications.