Effects of Four Different Types of Nitride and Oxide Particles on the Thermal Performance of an Epoxy Resin Used in Microelectronic Devices

The main purpose of this study was to investigate the effects of 10, 20, and 40 wt% micron-sized particles (aluminum nitride, aluminum oxide, silicon nitride, and silicon oxide) on the thermal performance of an epoxy resin used in microelectronic devices. Specimens were produced via a solution mixing technique followed by molding and curing. Although there were slight differences between the particle types used, various thermal analyses revealed that increasing the amount of all particle types significantly improved the thermal performance of the epoxy resin. The property that influences the thermal performance of microelectronic devices the most is thermal conductivity (λ). Heat produced during operation should be released via heat diffusion, which requires a certain level of λ. In this study, the use of a 40 wt% particle content increased the thermal conductivity (λ) by more than 3 times compared to neat epoxy (0.15 W/m·K). Another significant problem during the operation of these devices is the formation of “thermal strain mismatch” due to the different thermal expansion coefficients (α) of the materials used in the device that might lead to a loss of dimensional stability and malfunctioning. In this study, a particle content of 40 wt% decreased the thermal expansion coefficient of epoxy (49 × 10−6/K) down to 28 × 10−6/K, a decrease of −43%. Thermal performance also depends on the Glass Transition Temperature (Tg) values. In this study, a particle content of 40 wt% increased the Tg from 51 °C (neat epoxy) to 68 °C, an increase of 17 °C, and increased the Thermal Degradation Temperature (Td) from 324 °C (neat epoxy) to 356 °C, an increase of 32 °C. Moreover, it was also revealed that there was no decrease in the lap shear adhesion strength of the epoxy resin after incorporation of any of the particle types. Additionally, the particles also increased the mechanical rigidity of the epoxy in terms of Storage Modulus at 25 °C and 50 °C.