High-brightness LEDs are increasingly being adopted in applications beyond traditional backlighting and signage, such as automotive lighting, medical devices, and industrial equipment. As a result, the reliability of die bond materials has become a critical factor in ensuring LED performance under harsh operating conditions. The adhesive used to fix the LED chip directly affects thermal management and optical stability. Epoxy-based adhesives are widely used due to their strong adhesion and cost-effectiveness; however, they suffer from thermal degradation and yellowing when exposed to high temperatures, leading to reduced transparency and diminished brightness retention. Silicone-based adhesives offer superior thermal and optical properties, including excellent transparency and heat resistance, but exhibit poor adhesion to metal substrates such as silver lead frames, which can result in delamination. These limitations highlight the need for advanced die bond materials that can simultaneously achieve high thermal stability and strong adhesion to various substrates. Developing such materials is essential for enhancing the reliability and performance of nextgeneration LED packages, especially in high-power and high-temperature environments.
Manabu Miyawaki (2026) studied this question.