Phonon Thermal Transfer Analysis at Interface between Filler and Resin

Puntos clave

• This research aims to analyze the thermal transfer mechanisms at the interface between filler and resin in high-performance heat dissipation materials.
• Visualized thermal conduction pathways using FIB-SEM observation.
• Calculated interface thermal transfer coefficient (Tc) experimentally.
• Conducted molecular dynamics (MD) analysis to compute Tc against a defined interface model.
• Examined the relationship between surface treatment density/length and Tc.
• Experimental and MD results for Tc matched within 10% difference, validating the MD analysis.
• Identified optimal conditions for maximizing Tc based on density and length of molecular chains at the interface.
• Demonstrated that steric hindrance limits the penetration of resin molecules at the interface.