A Correlation with the Deformation Stored Energy and Self-Annealing Behavior of ETP-Cu

In the present study, room temperature (RTR) and cryogenic (CR) rolling of electrolytic tough pitch copper (ETP-Cu) was performed to elucidate how deformation temperature and reduction ratio (40% and 80% thickness reductions) control dislocation storage, local stored energy (SE), and self-annealing. Correlated SEM/EDS and EBSD analyses were used to (i) locate Cu2O particles, (ii) quantify local misorientation, and (iii) map the SE for self-annealing. Point EDS confirms that the intermetallic particles are copper oxides (Cu2O), with apparent O content varying with particle size and EDS interaction volume. RTR80 (80% rolled) exhibits systematically higher KAM values and a larger area fraction of high SE than RTR40 (40% rolled), explaining the greater frequency and spatial density of self-annealed grains at higher reduction. Cryogenic rolling produces more severe fragmentation and a higher fraction of subgrains than RTR at equivalent reductions. CR80 shows the high KAM structures and locally highest SE regions among all conditions, and a higher fraction of self-annealed grains. Nevertheless, the mapped average SE for CR80 (2.93 × 106 J/m3) was lower than for RTR80 (3.34 × 106 J/m3) due to rapid post-deformation dislocation annihilation/self-annealing upon warming at RT. In all conditions, Cu2O particles and bulged/irregular grain boundaries concentrate dislocations and SE and act as dominant particle-stimulated nucleation (PSN) sites and RT recrystallization, respectively. These results demonstrate that deformation temperature and reduction jointly determine the spatial distribution of SE and hence the propensity for self-annealing in ETP Cu.