This white paper presents the Component Integrity and Lifecycle Management (CILM) methodology — an integrated framework for managing supply chain risks in electronic component procurement. The methodology addresses counterfeit detection, supplier qualification, traceability, and lifecycle risk assessment across the full component procurement cycle. CILM was independently developed and first articulated publicly in November 2025. The framework draws on 27 years of practitioner experience in electronic component distribution and incorporates empirical data from the CILM-IRI dataset of 67 anonymized real-world procurement incident records. Key contributions: (1) a four-layer risk assessment architecture for component integrity verification; (2) alignment with NIST SP 800-161, CHIPS Act, and Executive Order 14017 policy objectives; (3) a Component Integrity Risk Score (CIRS) model validated via OLS regression (NDAA disruption indicator: β≈+478, p<0.01); (4) implementation guidance for industrial electronics, civilian medical equipment, automotive, and industrial automation sectors. Independent institutional convergence: Within weeks of CILM's public formalization (November 2025), Mikron JSC and the Moscow Government independently announced a structurally analogous initiative (December 2025). This convergence occurred independently and without any collaboration or communication with the author. This document is an independent practitioner white paper. It has not undergone formal peer review. Dataset (CILM-IRI v1.0) prepared for submission to IEEE DataPort under CC BY 4.0.
Alexander Litvin (Mon,) studied this question.