This research demonstrates a new layered platform that reduces temperature rise in surface acoustic wave devices, indicating enhanced power handling capabilities.
Key Points
The aim is to address the challenges of acoustomigration and thermal instability in high-power acoustic wave transducers.
Proposing a layered acoustic wave platform with a multifunctional top layer
Analyzing its impact on mechanical and thermal boundary conditions
Testing the performance metrics against state-of-the-art devices.
Achieved a 70% reduction in temperature rise
Measured a frequency temperature coefficient of −13 ppm/°C
Attained a threshold power density of 45.61 dBm/mm², significantly higher than existing thin-film devices.