The rapid increase in memory power density has made memory thermal management a critical challenge in high-density servers, where extremely limited DIMM spacing significantly reduces the effectiveness of air cooling. Compared with CPUs and GPUs, memory-level liquid cooling has received less systematic study, particularly regarding the influence of cold plate structural design on thermal and hydraulic performance under realistic server conditions. In this paper, three engineering-feasible memory liquid cooling solutions (water-flowing cold plate, clamp-type cold plate and heat-pipe-based cold plate) are experimentally compared on a high-density server system. Experiments are conducted at coolant inlet temperatures of 37–50 °C with a fixed flow rate of 0.8–1.5 L/min. Memory, CPU, and voltage regulator temperatures, as well as system pressure drop, are measured. Results show that memory temperature increases with coolant inlet temperature for all configurations, while their relative performance remains unchanged. Memory temperatures range from 62.04 to 71.13 °C, 57.65 to 66.98 °C, and 66.22 to 76.07 °C, with corresponding pressure drops of 24.19–26.69 kPa, 32.73–35.98 kPa, and 27.00–29.96 kPa. These results provide insight into the role of coolant distribution and flow-path topology in memory thermal performance.
Chen et al. (2026) studied this question.